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3M™ Boron Nitride Cooling Fillers |
Aluminum Oxide (Al2O3) |
| Raw Materials |
- Lower loading level
- Lower material consumption for thin-walled parts
|
- Requires higher filler loading to generate desired thermal conductivity
|
| Processing |
- Faster cycle times and line speeds
- Easier to process thin-walled and complex shapes
- No increase in wear on process tooling
- No dust build-up during processing
|
- Hard to process complex or thin-walled shapes
- Hard, abrasive particles cause wear on process tooling
|
| Final Article |
- Lighter weight, thinner parts
- High heat removal capability
- Simpler, more compact designs
- High reflectivity
|
- Higher density, heavier parts
- Low reflectivity for LED applications
|
| Property |
3M™ Boron Nitride Cooling Filler Platelets |
3M™ Boron Nitride Cooling Filler Flakes* |
3M™ Boron Nitride Cooling Filler Agglomerates* |
| Form |
Highly crystalline BN single platelets |
Hybrid flake agglomerate of crystalline BN platelets |
Bulk agglomerate of crystalline BN platelets |
| Aspect Ratio |
|
Up to 30 |
1-2 |
| Particle Size (mean) |
1-15µm |
50-400µm |
20-400µm |
| Bulk Density (Scott) |
0.05-0.55 g/cm3 |
0.6-0.8 g/cm3 |
0.25-0.5 g/cm3 |
| Mohs hardness |
<2 |
| Electrical Resistance |
>1015 Ohm*cm |
| Dielectric Constant |
3.9 |
| Thermal Conductivity |
400 W/m*k (in-plane) |
| Applications |
Thermoplastic polymers |
Thermoplastic polymers, thermosets, resins |
Thermal interfaces (foils, pads, adhesives) |
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